Red anodized embedded chassis
Customize Embedded PC Cases, Aluminum Housing, Fanless PC chassis
Red anodized rackmount chassis made by CNC milling and stamping. Aluminum alloy has high thermal conductivity and heat dissipation. We also provide assembling or mounting service depends on the requirements.
Features
- Developing customize tooling with customers requirement.
- Light weight.
- Highly thermal conductivity and heat dissipation.
- Flexibility on appearance.
Material
6061 / 6063 / 5052 Aluminum
Main Processing
CNC Milling → Stamping → Drilling → Tapping
Surface Treatment
Hairline Process / Sand-Blasting or Abrasive / Anodizing / Ultrasonic Cleaning / Vibrating Finishing.
Other Process
Assembling / Packing / Thermal Adhesive or Thermal Grease.
Applicable Industry
- Intelligent systems industry
- 3C Industry
- Medical Device Industry
- Transportation Industry
- Telecommunication Industry
- Factory Automation Industry
- Public Information Display Industry
- POS Industry
- Photo Gallery
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More DetailsHow can thermal-optimized chassis design improve your embedded system reliability?
Our red anodized embedded chassis features superior thermal conductivity that efficiently dissipates heat without fans, extending component lifespan by up to 40% and reducing system failures. Han Chang's aluminum alloy enclosures provide passive cooling that eliminates noise, dust accumulation, and mechanical failure points—critical advantages for mission-critical embedded applications in medical, transportation, and industrial environments.
Our embedded chassis solutions can be fully customized to meet specific application requirements, with options for various surface treatments including hairline process, sand-blasting, anodizing, and vibration finishing. Han Chang's comprehensive manufacturing capabilities extend beyond production to include assembly, thermal adhesive application, and custom packaging services. With over 30 years of industry experience, we deliver lightweight yet robust aluminum housings that combine superior heat dissipation with flexible design possibilities, ensuring optimal performance for intelligent systems across multiple industries including factory automation, telecommunications, and medical device sectors.